陈立东
简 历:陈立东,中国科学院上海硅酸盐研究所研究员、高性能陶瓷和超微结构国家重点实验室主任。1960年生,1981年毕业于湖南大学,1990年4月获日本东北大学工学博士学位。先后在日本RIKEN公司、日本航空宇宙技术研究所、日本东北大学金属材料研究所(助手、副教授)工作。2001年获中科院“百人计划”资助进入上海硅酸盐研究所工作,2003年获国家杰出青年基金资助,2009年获国家自然科学基金委创新群体科学基金资助。长期从事热电材料的设计合成、热电器件集成与应用技术的研究。发表学术论文300余篇,获中国、美国等授权发明专利50余项,著《热电材料与器件》(2018,科学出版社)。先后获国家自然科学二等奖(2013,排名第一)和国家技术发明二等奖(2014,排名第四)。
题 目:类液态热电材料:进展与展望
摘 要:Since the concept of liquid-like thermoelectric materials was proposed in 2012, a lot of ionic conductors, such as Cu-based
chalcogenides and Ag-containing compounds, have been reported exhibiting “phonon-liquid electron-crystal” (PLEC) transport
characters and their thermoelectric figure of merits have been continuously renovated up to larger than 2.0. Despite their complex
phase transitions and diverse crystal structures, liquid-like materials in common are featured in having two independent sub-lattices:
one rigid sub-lattice formed by immobile ions and one liquid-like sub-lattice consisting of highly mobile ions. The former provides
the charge-transport network maintaining a decent electrical performance, while the liquid-like ions could not only scatter the
phonons but also eliminate part of transverse vibrational models resulting in intrinsically ultra-low lattice thermal conductivity. As one
of the typical liquid-like thermoelectric material systems, Cu-based chalcogenides Cu2X (X=S, Se, Te) have been widely studied to
enhance their performance through various approaches such as doping, alloying, band engineering, and nanostructuring as well.
Especially, their unique phonon transport receives wide attention and the phonon dynamics has been profoundly studied. Among
the most challenging issues for the liquid-like materials, to prevent performance degradation caused by the migration of Cu ions, has
been taken into investigation through deeply understanding the mechanism of ion migration and structure degradation. A peak
energy conversion efficiency of 9.1% under the temperature difference of 680 K has been demonstrated in a Cu2Se-based prototype
module. Although the Cu-based liquid-like thermoelectric materials really possess advantages in low cost and high zT at high
temperatures and significant achievements have been made on this new category of materials in the past decade, the liquid-like
thermoelectrics are still on a far way to the practical applications. Further challenges in the aspects of both materials and devices,
such as the lack of high-performance n-type Cu/Ag-based liquid like materials, the difficulty in electrode bonding technology, and the
long term stability of device, should be faced squarely nowadays and in the future.